Technical Fellow, Advanced Packaging & HPC Strategy

A leading semiconductor intelligence firm is looking for a Technical Fellow in Ottawa to shape the technical direction for Advanced Packaging and High Performance Computing. This role involves being a subject matter expert, guiding the evolution of technology roadmaps, and leveraging AI tools for analysis. Ideal candidates will have a Master's or PhD with 10+ years in semiconductor-related fields, skilled in advanced packaging and system-level performance. Join a team committed to innovation and inclusivity.
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