Microelectronic Packaging Design Engineer - End-to-End

A leading engineering services provider in Ottawa is seeking a Microelectronic Packaging Design Engineer. This role involves defining technologies and designs for microelectronic modules, ensuring compliance, and generating product documentation. The ideal candidate has at least 5 years of experience in electronic hardware design, particularly in Wafer Level and Chip Scale Packaging. Proficiency in CAD software is essential. Strong communication skills and customer focus are highly valued.
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